Rising need for ICs is expected to be fueled by incline in demand for electronic systems. Introduction of stacked die technology in Internet of Things (IoT) enabled products, rising demand for semiconductor integrated circuits, increasing usage of hybrid laptops, and high-definition television are all driving revenue growth in the global die bonder equipment market. Major Factors Driving Growth Of The Global Die Bonder Equipment Market: Various processes, including eutectic bonding, soldering, adhesive bonding, and glass/silver-glass bonding are used in die bonding process. The most typical method of die bonding is to use a pin to push desired die away from the tape. Various methods such as epoxy, eutectic, soft solder, and flip chip, are also employed to attach die to the substrate. A die attaching equipment's primary duty is to pick die from wafer or waffle tray and connect it to substrate. Die binders and die attaching equipment are two terms for same thing.
As a result, die bonder equipment is widely employed in semiconductor device manufacture. Other factors such as increasing complexity of semiconductor IC designs and rising demand for high-quality semiconductor ICs for wireless applications are expected to support market growth going ahead.ĭie binders are a form of semiconductor packaging and assembly equipment that is used to adhere a chip to a package or substrate. Market revenue growth is attributed to rising demand for small electronic components and increasing implementation of stacked die technology in Internet of Things (IoT) devices. Securities and Exchange Commission, including, but not limited to, the Company's report on Form 20-F for the year ended December 31, 2002.The global die bonder equipment market size was significantly robust in 2020 and is expected to register a steady revenue CAGR over the forecast period. These include, but are not limited to, economic conditions and trends in the semiconductor industry, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, litigation involving intellectual property, shareholder and other issues, commercial and economic disruption due to terrorist activity, armed conflict or political instability and other risks indicated in the Company's filings from time to time with the U.S. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements.
Private Securities Litigation Reform Act of 1995: All matters discussed in this statement, except for any historical data, are forward-looking statements.
0 kommentar(er)
